Copper anodes are soluble metal components that play a critical role, particularly in electroplating applications.

Technical Specifications and Intended Use

• Operating Principle: When an electric current is applied within the plating bath, the anode gradually dissolves, releasing copper ions into the solution. These ions adhere to the surface of the object to be coated (the cathode), forming a smooth and homogeneous layer.
  
  
• High Purity Level: To ensure maximum performance and quality, they are typically manufactured using copper with a purity of 99.9%.
  
  
• Low-Oxygen Technology: To minimize the risk of contamination, oxygen-free copper (OFE or OFHC) is preferred; this provides superior conductivity and a cleaner plating process.
  
  
• Physical Forms: Depending on the specific application, they are available in various forms, including nuggets, plates, or bars.